Capability
Lead Jump > Capability
General
Item | Specification |
---|---|
Number of Layer | 1~24 |
Material | CEM-3,FR-4,HTg halogen free Free / 環保材料 |
Finish Board Thickness | 0.2mm~3.20mm (8mil~126mil) |
Minimum Core Thickness | 0.075mm (3mil) |
Copper Thickness | 1/2 oz min. 6 oz max. |
Min. Trace Width & Line Spacing | 0.075mm (3mil) Flash gold |
Min.Hole Diameter CNC Drilling | 0.25mm(10mil) |
Min.Hole Diameter Punching | 0.9mm (35mil) |
Surface Treatment on Land Area | Nickel / Gold Plating / OSP / Hot Air Leveling / Immersionsilver / ENIG / Immersion Tin |
Insulation Resistance | 10K ohm ~ 20M ohm |
Conductivity | 20-50 ohm |
Test Voltage | 220-250V |
Slot (Slot size tol. > = 2W公差) | PTH L: +/-0.15mm (6mil) W:+/-0.1mm (4mil) Where:L=Slot length W=Slot width Min.drill |
NPTH L: +/-0.125mm (5mil) W:+/-0.1mm (4mil) bit size for multi-drill is 0.7mm |
|
Minimum spacing between hole edge to circuitry pattern | PTH Hole: 0.13mm (5mil) |
NPTH Hole: 0.18mm (7mil) speical control 0.15mm(6mil min) |
|
Registration Tolerance of Front/Back image (Front image vs back image) | 0.075mm (3mil) special control 0.05mm(2mil min) |
Dimension Tolerance
Item | Specification |
---|---|
Hole Position | +/-0.075mm(3mil) CNC Drilling |
Conductor Width(W) | +/-0.05mm(2mil)or +/-20% of original artwork |
Hole Diameter(H) | PTH+/-0.075mm (3mil)Non-PTH+/-0.05mm(2mil) |
Outline Tolerance | +/-0.15mm (6mil)by CNC Routing |
+/-0.10mm (4mil)by punching | |
Warp & Twist | 0.7% |
V-cutting
Item | Specification |
---|---|
Panel Size | 110X100mm (min.) 660X600mm (max.) |
Board Thickness | 0.5mm (20mil)min. ~3.2mm (125mil)max. |
Remain Thickness | 0.3mm (12mil)min. |
Tolerance | +/-0.1mm (4mil) |
Groove Width | 0.50mm (20mil)max. |
Groove to Groove | 10mm min. |
Groove to Trace | 0.50mm (20mil)min. |
Multilayers
Item | Specification |
---|---|
Layer-layer misregistration | 0.10mm (4mil)max. |
Min.spacing between hole edge to circuitry pattern of an inner layer | 0.25mm (10mil) |
Min.spacing between board outline to circuitry pattern of an inner layer | 0.38mm (15mil) |
Board thickness tolerance | board thickness <1.0mm,±0.1mm |
1.0≤board thickness <1.6mm,±0.1mm | |
board thickness ≥1.6mm,±(Thickness ×10%) | |
Impedance Control | 60 ohm+/-10% |