Lead Jump

General

ItemSpecification
MaterialFR4.0 -- Tg130, Tg150, Tg170
FR4.1 (Halogen-free) -- Tg150, Tg170
Radio Frequency laminate
Number of Layer1~24
Surface FinishOSP, LF-HASL, Immersion Tin,
Immersion Silver, ENIG, Gold Plating
Board Size80mm x 100mm (min.)
600mm x 660mm (max.)

Hole (Mechanical drill)

ItemSpecification
Min. Via Size0.15mm (6mil)
CAF DistanceHole-hole edge : 0.4mm (16mil)
Drill-drill edge : 0.3mm (12mil)
Drill edge - Inner Copper : 0.16mm (6.5mil)
Plating Aspect Ratio10 : 1
Drill Registration+/-0.05mm (+/-2mil)
Press-fit Hole+/-0.05mm (+/-2mil)

Special Board Feature Design​

ItemSpecification
Back DrillYes
HDI Laser Micro-viaYes
Blind/Buried ViaYes
Mixed Material StructureYes,
By RF material + FR4 material
Short Gold-Finger (no plating tie-bar)Yes
Selective Surface FinishYes,
By ENIG + OSP
By ENIG + LF-HASL
Copper Pillar FillYes
Via In PadYes,
By Conductive Copper paste
By Non-conductive Resin
Half Plated-holeYes

Inner

ItemSpecification
Trace Width / Space0.075mm / 0.075mm (3mil / 3mil)
Core0.05mm min. (2mil min.)
Copper Weight0.5 oz - 4oz
CAF distanceCopper-drill edge : 0.16mm (6.5mil)
Layer registration0.1mm max. (4mil max.)

Outer

ItemSpecification
Trace Width / Space0.075mm / 0.075mm (3mil / 3mil)
Copper Weight0.5 oz - 6oz
BGA sizeSize : 0.2mm (8mil)
Grid : 0.4mm (16mil)

Solder Mask

ItemSpecification
ColorGlossy / Matte : Green, Blue, Black
Glossy : White, Red, Yellow
Thickness0.01mm - 0.05mm (0.4mil - 2mil)
Dam width0.075mm - 0.1mm (3mil - 4mil)

Silkcreen

ItemSpecification
ColorWhite, Black, Yellow, Grey
DMC/QR CodeYes
Serial NumberYes

Profile

ItemSpecification
MethodRoute
Punch
Tolerance+/-0.1mm (+/-4mil)
Control Depth RouteYes,
Depth Tolerance : +/-0.2mm (+/-8mil)
Recess BevellingYes