Lead Jump

General

ItemSpecification
Number of Layer1~24
MaterialCEM-3,FR-4,HTg halogen free
Free / 環保材料
Finish Board Thickness0.2mm~3.20mm (8mil~126mil)
Minimum Core Thickness0.075mm (3mil)
Copper Thickness1/2 oz min. 6 oz max.
Min. Trace Width & Line Spacing0.075mm (3mil)
Flash gold
Min.Hole Diameter CNC Drilling0.25mm(10mil)
Min.Hole Diameter Punching0.9mm (35mil)
Surface Treatment on Land AreaNickel / Gold Plating / OSP / Hot Air Leveling / Immersionsilver / ENIG / Immersion Tin
Insulation Resistance10K ohm ~ 20M ohm
Conductivity20-50 ohm
Test Voltage220-250V
Slot
(Slot size tol. > = 2W公差)
PTH L: +/-0.15mm (6mil) W:+/-0.1mm (4mil)

Where:L=Slot length
W=Slot width Min.drill
NPTH L: +/-0.125mm (5mil) W:+/-0.1mm (4mil)

bit size for multi-drill is 0.7mm
Minimum spacing between hole edge to circuitry patternPTH Hole: 0.13mm (5mil)
NPTH Hole: 0.18mm (7mil)

speical control 0.15mm(6mil min)
Registration Tolerance of Front/Back image (Front image vs back image)0.075mm (3mil)

special control 0.05mm(2mil min)

Dimension Tolerance

ItemSpecification
Hole Position+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)+/-0.05mm(2mil)or +/-20% of original artwork
Hole Diameter(H)PTH+/-0.075mm (3mil)Non-PTH+/-0.05mm(2mil)
Outline Tolerance+/-0.15mm (6mil)by CNC Routing
+/-0.10mm (4mil)by punching
Warp & Twist0.7%

V-cutting

ItemSpecification
Panel Size110X100mm (min.) 660X600mm (max.)
Board Thickness0.5mm (20mil)min. ~3.2mm (125mil)max.
Remain Thickness0.3mm (12mil)min.
Tolerance+/-0.1mm (4mil)
Groove Width0.50mm (20mil)max.
Groove to Groove10mm min.
Groove to Trace0.50mm (20mil)min.

Multilayers

ItemSpecification
Layer-layer misregistration0.10mm (4mil)max.
Min.spacing between hole edge to circuitry pattern of an inner layer0.25mm (10mil)
Min.spacing between board outline to circuitry pattern of an inner layer0.38mm (15mil)
Board thickness toleranceboard thickness <1.0mm,±0.1mm
1.0≤board thickness <1.6mm,±0.1mm
board thickness ≥1.6mm,±(Thickness ×10%)
Impedance Control60 ohm+/-10%