Product Type
We produce PCBs from double sided PCBs up to 14 layers
Product Technology
Hot Air Leveling with Lead Free
Flash gold plating
Immersion gold (ENIG)
Selective gold plating / Gold finger plating
OSP
Immersion Silver
Immersion Tin
| A. Fine Trace | |
| Customer:Japan | Trace width: 0.075 mm (min.) |
| Trace spacing: 0.075mm (min.) | Others: BGA |
| B. Micro-BGA | |
| Customer: Thailand | Hole size: 0.35 mm (min.) |
| Thickness: 1.57±0.13mm | Pitch: 0.5mm;0.3 mm (Spacing); 0.2 mm (Diameter) |
| C. High Layer Count | |
| Customer: America | Layer count: 14 |
| Copper thickness: 3 oz | Others: Blind & Buried hole |
| D. Heavy Copper& High Layer Count | |
| Customer: America | Copper spec.: 4 oz |
| Thickness: 3.2+0.27mm/-0.22mm | Layer count: 12 |
| E. High Aspect Ratio | |
| Customer: Hong kong | drill bit size: 0.2 mm |
| Thickness: 1.45±0.1mm | Surface finished: ENIG |
| F. High Layer Count | |
| Customer: America | Layer count: 16 |
| Copper thickness: 3 oz | Others: Blind & Buried hole |