Product Type
We produce PCBs from double sided PCBs up to 14 layers
Product Technology
Hot Air Leveling with Lead Free
Flash gold plating
Immersion gold (ENIG)
Selective gold plating / Gold finger plating
OSP
Immersion Silver
Immersion Tin

A. Fine Trace |
Customer:Japan |
Trace width: 0.075 mm (min.) |
Trace spacing: 0.075mm (min.) |
Others: BGA |

B. Micro-BGA |
Customer: Thailand |
Hole size: 0.35 mm (min.) |
Thickness: 1.57±0.13mm |
Pitch: 0.5mm;0.3 mm (Spacing); 0.2 mm (Diameter) |

C. High Layer Count |
Customer: America |
Layer count: 14 |
Copper thickness: 3 oz |
Others: Blind & Buried hole |

D. Heavy Copper& High Layer Count |
Customer: America |
Copper spec.: 4 oz |
Thickness: 3.2+0.27mm/-0.22mm |
Layer count: 12 |

E. High Aspect Ratio |
Customer: Hong kong |
drill bit size: 0.2 mm |
Thickness: 1.45±0.1mm |
Surface finished: ENIG |

F. High Layer Count |
Customer: America |
Layer count: 16 |
Copper thickness: 3 oz |
Others: Blind & Buried hole |