PRODUCT TYPE & PRODUCTION TECHNOLOGY

Product Type

We produce PCBs from double sided PCBs up to 14 layers

 

Product Technology

Hot Air Leveling with Lead Free
Flash gold plating
Immersion gold (ENIG)
Selective gold plating / Gold finger plating
OSP
Immersion Silver
Immersion Tin
tech1

A. Fine Trace
Customer:Japan Trace width: 0.075 mm (min.)
Trace spacing: 0.075mm (min.) Others: BGA

tech2

B. Micro-BGA
Customer: Thailand Hole size: 0.35 mm (min.)
Thickness: 1.57±0.13mm Pitch: 0.5mm;0.3 mm (Spacing); 0.2 mm (Diameter)

tech3

C. High Layer Count
Customer: America Layer count: 14
Copper thickness: 3 oz Others: Blind & Buried hole

tech4

D. Heavy Copper& High Layer Count
Customer: America Copper spec.: 4 oz
Thickness: 3.2+0.27mm/-0.22mm Layer count: 12

tech5

E. High Aspect Ratio
Customer: Hong kong drill bit size: 0.2 mm
Thickness: 1.45±0.1mm Surface finished: ENIG

tech6

F. High Layer Count
Customer: America Layer count: 16
Copper thickness: 3 oz Others: Blind & Buried hole