| Item | Specification | Remarks | |
| Number of Layer | 1~14 | ||
| Material | CEM-3,FR-4,HTg halogen free | Free / 環保材料 | |
| Finish Board Thickness | 0.2mm~3.20mm (8mil~126mil) | ||
| Minimum Core Thickness | 0.075mm (3mil) | ||
| Copper Thickness | 1/2 oz min. 4 oz max. | ||
| Min. Trace Width & Line Spacing | 0.075mm (3mil) | Flash gold | |
| Min.Hole Diameter CNC Drilling | 0.25mm(10mil) | ||
| Min.Hole Diameter Punching | 0.9mm (35mil) | ||
| Dimension Tolerance | Hole Position | +/-0.075mm(3mil) CNC Drilling | |
| Conductor Width(W) | +/-0.05mm(2mil)or +/-20% of original artwork | ||
| Hole Diameter(H) |
PTH+/-0.075mm (3mil)Non-PTH+/-0.05mm(2mil) |
||
| Outline Tolerance | +/-0.15mm (6mil)by CNC Routing | ||
| +/-0.10mm (4mil)by punching | |||
| Warp & Twist | 0.7% | ||
| Surface Treatment on Land Area | Nickel / Gold Plating / OSP / Hot Air Leveling / Immersionsilver / ENIG / Immersion Tin | ||
| Insulation Resistance | 10K ohm ~ 20M ohm | ||
| Conductivity | 20-50 ohm | ||
| Test Voltage | 220-250V | ||
| V-cutting | Panel Size | 110X100mm (min.) 660X600mm (max.) | |
| Board Thickness | 0.5mm (20mil)min. ~3.2mm (125mil)max. | ||
| Remain Thickness | 0.3mm (12mil)min. | ||
| Tolerance | +/-0.1mm (4mil) | ||
| Groove Width | 0.50mm (20mil)max. | ||
| Groove to Groove | 10mm min. | ||
| Groove to Trace | 0.50mm (20mil)min. | ||
| Slot | Slot size tol. > = 2W公差 | PTH L: +/-0.15mm (6mil) W:+/-0.1mm (4mil) | Where:L=Slot length |
| W=Slot width Min.drill | |||
| NPTH L: +/-0.125mm (5mil) W:+/-0.1mm (4mil) | bit size for multi-drill is 0.7mm | ||
| Minimum spacing between hole edge to circuitry pattern | PTH Hole: 0.13mm (5mil) | ||
| NPTH Hole: 0.18mm (7mil) | speical control 0.15mm(6mil min) | ||
| Registration Tolerance | Front image vs back image | 0.075mm (3mil) | special control 0.05mm(2mil min) |
| of Front/Back image | |||
| Multilayers | Layer-layer misregistration | 0.10mm (4mil)max. | |
| Min.spacing between hole edge to circuitry pattern of an inner layer | 0.25mm (10mil) | ||
| Min.spacing between board outline to circuitry pattern of an inner layer | 0.38mm (15mil) | ||
| Board thickness tolerance | board thickness ＜1.0mm，±0.1mm | ||
| 1.0≤board thickness ＜1.6mm，±0.1mm | |||
| board thickness ≥1.6mm，±（Thickness ×10%） | |||
| Impedance Control | 60 ohm+/-10% | ||